Sagacious IP delivers quality analysis and reports in partnership with a Chinese counterpart which has diverse capability in providing Reverse Engineering analysis of various electronic products including IC technical analysis, IP analysis, Chip Security Detection services and Chip design services.
Reverse engineering, also known as back engineering, refers to the process of deconstructing machines, software, architectural structures, and other products for obtaining design information.
Reverse engineering helps you understand the design of a part or complete machine, software, architectural structure, and other products so that you can recreate them. Companies generally use reverse engineering when they cannot buy a replacement component from an original equipment manufacturer (OEM).
A US-based NPE wanted to know the subsystem details of a top selling mobile phone, which was marketed by a leading consumer electronics player. The study involved techniques from tear-down to die imaging, showing the details at both sub-system and circuit level. This study revealed the technical information on subsystems as required, such as component model, manufacturer, etc. which was used to create detailed claim charts (EoUs)
A US-based law firm wanted to know the ESD protection solution used in a top product. The device of interest was a 123Mbit, 3.0V-only, page mode memory featuring 0.11 μm technology.
An ESD protection analysis was provided to the device of interest, involving delayering, image processing, die imaging, circuit analysis, etc. to collect evidence for a difficult to map claim and produce a litigation-grade claim chart.
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